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PCB Produce and Assembly
CapabilitiesSurface Mount Technology/ Parts (SMT Assembly)Through-Hole Device/ Parts (THD)Mixed Parts: SMT & THD assemblyBGA/ Micro BGA / uBGAQFN, POP & lead-less chips2800 pin-count BGA0201/ 1005 passive components0.3/ 0.4 PitchPoP PackageFlip-chip under |
2019-10-22 |
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SMT PCB Layout
(1) Gerber data for all artwork layers(2) Aperture list or lists for all layers(3) Drill file in Gerber or Excellon format(4) Drawings: Print should be hard copy or Gerber HPGL or DXF format |
2019-10-10 |
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PCB Design Service
Surface Mount Technology/ Parts (SMT Assembly)Through-Hole Device/ Parts (THD)Mixed Parts: SMT & THD assemblyBGA/ Micro BGA/ uBGAQFN, POP & lead-less chips2800 pin-count BGA0201/ 1005 passive components0.3/ 0.4 PitchPoP PackageFlip-chip under-filled CCGAB |
2019-09-28 |
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PCB Design and Assembly Service
Surface Mount Technology/ Parts (SMT Assembly)Through-Hole Device/ Parts (THD)Mixed Parts: SMT & THD assemblyBGA/ Micro BGA/ uBGAQFN, POP & lead-less chips2800 pin-count BGA0201/ 1005 passive components0.3/ 0.4 PitchPoP PackageFlip-chip under-filled CCGAB |
2019-09-12 |
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Turnkey PCB Design
Laminates: FR4(TG130, TG150, TG170), High frequency, Halogen free, Aluminum baseLayers: 1-32Max Size: 800mm X 650mmMin.Board Thickness: 2L: 0.20mm, 4L: 0.40mm, 6L:0.60mm, 8L:0.80mm, 10L:1.20mmFinished Copper: Inner:12-175um Outer:35-350umMin.Line/Space: 3 |
2019-07-19 |
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